Tom,
In a word - NOT RECOMMENDED.
Sockets do not provide connections as good as soldering in place, the
sockets make the RF paths longer which may cause problems, and are another
source for failure. The RF Path lengths would be especially sensitive in
the bandpass filter area of the K2, the relays should be soldered in place.
Components do not fail often, so replacement of components is not a valid
concern in hardware that uses a conservative design (like the K2) which does
not stress the components beyond their ratings.
As for tie-in of external circuits, that can be done by soldering to IC pins
or by placing components on the bottom of the board.
Upgrades usually do not involve changing a relay or an IC - most upgrades
involve only changes to resistors, capacitors, diodes and other similar
components, and a socketed arrangement will likely not help for any of the
upgrades that may come along.
73,
Don W3FPR
> -----Original Message-----
>
> I am thinking about inserting sockets under a couple of the
> relays on the RF
> board, to make it easy to connect some probes or tie in external
> circuitry
> later. Of course this would also make it easier to upgrade or
> replace them too.
>
> I would think using low profile sockets would not imact the
> physical/electrical integrity of the board. Wonder if anybody
> else has done
> this, or if there are any concerns about doing so.
>
> 73,
>
> Tom KG3V
>
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