I noted a reference to IPC-610 in a recent thread on soldering. I thought
readers might be interested in an 2011 article that takes a caustic view of IPC-610. TLDR: The work-inspect-rework mantra of IPC-610 is a recipe for reducing the reliability of assemblies: mainly due to heat stress caused by manual soldering being a higher-temperature operation that flow-soldering. You can read the article at https://www.assemblymag.com/blogs/14-assembly-blog/post/89217-the-curse-of-ipc-a-610-and-ipc-j-std-001 -- Gareth M5KVK ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:[hidden email] This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html Message delivered to [hidden email] |
I am aware of that article and did reference the fact that some do not like
these requirements. The author does not suggest an alternative. In the practice I have seen in the aerospace industry, there was not the large amount of rework described. The emphasis was on using correct processes to result in good solder joints the first time. Lots of other specs we're used and massive process development occurs in the manufacturing industry. The drive to take manufacturing overseas is due to lots of factors besides these specs. In my case, I use a reflow oven with controlled processes to produce good solder joints and only rework if it does not functioning, which is very rare. Reworking lead free SMT solder joints by hand would never produce ones as good as the reflow oven. Working with lead free solder by hand basically sucks, but that is another discussion. 73, Mark W7MLG On Mar 28, 2018 1:27 AM, "Gareth M5KVK" <[hidden email]> wrote: I noted a reference to IPC-610 in a recent thread on soldering. I thought readers might be interested in an 2011 article that takes a caustic view of IPC-610. TLDR: The work-inspect-rework mantra of IPC-610 is a recipe for reducing the reliability of assemblies: mainly due to heat stress caused by manual soldering being a higher-temperature operation that flow-soldering. You can read the article at https://www.assemblymag.com/blogs/14-assembly-blog/post/89217-the-curse-of-ipc-a-610-and-ipc-j-std-001 -- Gareth M5KVK ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:[hidden email] This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html Message delivered to [hidden email] ______________________________________________________________ Elecraft mailing list Home: http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/mmfaq.htm Post: mailto:[hidden email] This list hosted by: http://www.qsl.net Please help support this email list: http://www.qsl.net/donate.html Message delivered to [hidden email] |
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