>>I was not NASA certified but worked with techs that were. They explained that minimum solder, ie concave verses convex solder blob, was due to not inspection of solder pad. If the solder was piled on the inspectors would reject it because they had a harder time determining cold solder pads, minimal solder allowed proper inspection of the pad.<<
I was NASA certified and weight was the prime consideration...Most of our soldering involved high pin density cable connectors...Everything was inspected twice, first by our own QC, then by NASA...They did not want to see a filet at the solder cups of the connector pins, they wanted to see a void, with the wire little more than tacked into the cup...They did a pull test on every wire...No wicking or bird-caging of the stranded wire was allowed...All flux had to be removed and many connectors were crabbed due to the presence of flux...
We did not do an lot of circuit boards, but minimum solder was still the rule...Circuit board technology in the late 60's was rather primitive by today's standards and most of our boards were fabricated in house in the photo lab...There weren't many moon-shots, so board manufacture count was low...
Jerry, wa2dkg
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