When I constructed my K2, there were at least a dozen
smaller disc capacitors - with lead spacing wider than
the PCB board holes. In those cases I felt it was
better to mount the disc C close to the board and keep
the leads short. So in each case, I carefully bent
one of the leads at a right angle to the device, and
then measuring hole spacing - I would rebend that lead
down. Thereby creating the correct spacing of the
leads. The K2 came out fine, all to spec, and
all tests passed. So I guess I did it ok.
Depending on particular C device - I thought that
letting the device sit up in the air, with crunched
leads - would create a chance of stray RF pickup to
and from the device's leads. So I mounted it right
down against the board, with a very neat side device
wire going over to the PCB's other hole.
Fred,
N3CSY
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