Steve,
Most likely you will not see a difference (unless you spent like 10-30
seconds heating it up with your soldering iron). I don't know which Elecraft
kit you are talking about, but consider this.
Grounding crystals at the side will give you better decoupling under SOME
circumstances (like proper ground plane in the PCB, relatively close and
regular location of other crystals around, absence of other sources of
signal coupling nearby like another PCB or a signal trace with a strong
signal in it). Otherwise you will get so marginal benefit that you will not
notice it considering the tolerances of all the parts.
Also, sometimes the clearances between different parts are too tight and you
simply might not have enough space to ground crystals at the top of the can
because the grounding wire would touch some other part otherwise.
On the other hand, grounding at the top of the crystal somewhat decreases
the chance of overheating said crystal while soldering. Not that it's a
problem - it is easily handled if one is proficient with soldering iron (and
picks the right tool for the job, i.e. the appropriate wattage/temperature
iron), but for inexperienced builder it is safer to ground at the top.
Dear readers, please, forgive me the lecturing tone - I felt like goofing
out tonight.
On Wed, Mar 30, 2011 at 4:51 PM, W6EOD <
[hidden email]> wrote:
> I got a little ahead of myself while grounding crystals X1, 3 and 5. I
> grounded to the sides. Is this a problem. Should I add wire to take the
> ground to the top of the can?
>
> Steve W6EOD
>
>
--
Alexey Kats (neko)
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